New thin-film semiconductor techniques invented by University of Wisconsin-Madison engineers allow layers of double-sided, thin-film semiconductors to be stacked together, creating powerful, low-power, three-dimensional electronic devices.

Applications include solar cells, smart cards, RFID tags, medical applications, active-matrix flat panel displays, and flexible semiconductors embedded in fabric to create wearable electronics or computer monitors that roll up like a window shade.

Source: University of Wisconsin news