New 3D self-assembly methods could lead to 10 terabyte chips

September 7, 2004 | Source: Triangle Tech Journal

Two new patented methods for self-assembly of three-dimensional nanostructures could lead to the development of a chip that can hold 10 terabits of information — about 500 times the storage density available today.

The two methods involve using pulsed laser deposition, which works with a variety of materials and reduces imperfections. The sequential growth method uses the laser pulses to ablate successive targets to create layers of nanodots in a matrix. The simultaneous growth method is based on the difference in the oxidation rate of the nanodot and matrix materials. In this method the matrix and nanodots are deposited simultaneously on a substrate. Both methods produce consistent size and shape of the nanodots and demonstrate control of the materials that cannot be achieved by previously proposed methods.

The methods can be applied to almost any material. To create nanostructures for the different applications, the material used for the nanodots and the matrix are changed. For example, to create structures for data storage, nickel is ued; for solid-state applications, gallium nitride or zinc oxide is used; for superstrong materials, copper, tungsten carbide and nickel aluminide are used; and for ceramics, aluminum oxide is used.

Applications include super-dense data storage, solid-state lighting, super-strong materials and advanced detection systems.