July 24, 2001
Highly insulating new honeycomb material may allow microelectronic integrated circuits to be made even smaller, increasing the power of microchip and computer technology.
When electronic devices get very small, insulating silica films must be shrunk to the same proportions. Too thin, they become leaky and electrical currents seep out, creating problems such as crosstalk between different parts of the circuit.
Leakage could become a problem once the dimensions of… read more