May 29, 2015
University of Wisconsin-Madison and U.S. Department of Agriculture Forest Products Laboratory (FPL) researchers have jointly developed a wood chip in an effort to alleviate the environmental burden* of electronic devices.
Well, actually, a wood-substrate-based semiconductor chip. They replaced the silicon substrate portion in a conventional chip with environment-friendly cellulose nanofibril (CNF). CNF is a flexible, biodegradable material made from wood, as the researchers note in an… read more