Samsung to release ‘3D’ memory modules with 50% greater density

December 8, 2010 | Source: Computerworld

Samsung today announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other using through silicon via (TSV), which increases the density of the memory by 50% compared to conventional DIMM technology.

Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems. The TSV technology creates micron-sized holes through the chip silicon vertically instead of just horizontally, creating a much denser architecture.

The RDIMM product is likely to be generally available to equipment manufacturers in the second half of 2011.