Northeastern University researchers have developed a method for high-volume manufactuing of three-dimensional, single-wall carbon nanotube electrical interconnects without the need for high-temperature synthesis.

They assemble the nanotubes into 3D structures by using an applied electric field to coax the nanotubes into deep nanoholes in a porous alumina template.

The method could also integrate well into existing silicon platforms for use in microelectronics, field emission displays, electronic memory devices, and solar cells.