3D nanotube assembly technique for nanoscale electronics

October 23, 2008 | Source: PhysOrg.com

Northeastern University researchers have developed a method for high-volume manufactuing of three-dimensional, single-wall carbon nanotube electrical interconnects without the need for high-temperature synthesis.

(Evin Gultepe et al.)

(Evin Gultepe et al.)

They assemble the nanotubes into 3D structures by using an applied electric field to coax the nanotubes into deep nanoholes in a porous alumina template.

The method could also integrate well into existing silicon platforms for use in microelectronics, field emission displays, electronic memory devices, and solar cells.