Building electronics bottom-up
January 16, 2013
University of South Carolina’s Chuanbing Tang is out to turn the microelectronics industry upside down.
Currently, modern electronics are primarily fabricated by etching the smooth surface of a starting material — say, a wafer of silicon, using micro- or nanolithography to establish a pattern on it. This top-down method might involve a prefabricated template, such as a photomask, to establish the pattern.
But the approach… read more













